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Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

2 Volumes

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Bibliografische Daten
ISBN/EAN: 9780387279749
Sprache: Englisch
Umfang: LXII, 1460 S.
Auflage: 1. Auflage 2007
Einband: gebundenes Buch

Beschreibung

This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.

Autorenportrait

InhaltsangabeVolume I: Physics, Mechanics and Design.- Materials Physics.- Polymer Materials Characterization, Modeling and Application.- Thermo-Optic Effects in Polymer Bragg Gratings.- Adhesives for Micro- and Opto-Electronics Applications: Chemistry, Reliability, Mechanics.- Multi-stages Peel Tests and Evaluation of Interfacial Adhesion Strength Between Brittle Thin Film and Polymer Substrate.- Adhesion and Fracture of Interfaces in Microelectronic Packaging.- The Research Status of Isotropic Electrically Conductive Adhesives.- Electrically Conductive Adhesives.- Adhesive Bonding of Passive Optical Components.- Photorefractive Materials and Devices for Passive Components in WDM Systems.- Advanced Substrate Materials for Power Electronics.- Carbon nanotube Based Interconnect Technology: Opportunities and Challenges.- Materials Mechanics.- Thermal Stress Modeling in Micro- and Opto-Electronics: Review and Extension.- Area Array Technology for High Reliability Applications.- How to make an Opto-Electronic Device into a Product: Role of Accelerated Life Testing.- High-speed Tensile Testing of Optical Fibers - New Understanding for Reliability Prediction.- Uncertainty Modeling in Fiber-Optic Packages.- Multiphysics modelling and optimisation technology for design and reliability of microstystems: Review.- Application of Moire Interferometry to Strain Analysis of PCB Deformations at Low Temperatures.- Characterization of Stresses and Strains in Microelectronics and Photonics Devices Using Photomechanics Methods.- Analysis of Reliability of IC Packages Using Fracture Mechanics Approach.- A Methodology for an Integrated (Electrical/Mechanical) Design of PWBA.- Nonlinear Dynamic Response of Micro-Electronic Structures to Shock Loading.- Physical Design.- Wafer Level Underfill.- The Wirebonded Interconnect: A Mainstay for Electronics.- Metallurgical Interconnections for Extreme High and Low Temperature Environments.- Accelerated Testing for Optoelectronics.- Passive-alignment of Optical Fiber in a V-groove with Low Viscosity Epoxy Flow.- Volume II: Reliability and Packaging.- Fundamental Concepts of Reliability and Stress Testing.- Micro-Deformation Analysis and Reliability Estimation of Micro-Components by Means of NanoDAC Technique.- Packaging and Reliability for Foundry-Fabricated MEMS.- Reliability in Mobile Electronic Productions.- Dynamic of the Physical Reliability of Photonic Materials.- Durability of Packaged Nanostructures: Laser Diode Packages, A Case Study.- Reliability of VCSEL Package Coupling to Optoelectronic Circuit Boards.- Fatigue Life Assessment for Lead-Free Solder Joints.- Reliability of High Density Lead-Free Assemblies Under Shock-loading Conditions.- Design-for-Reliability Methodology for Modeling Lead-Free Solder Materials and Solder Joint Reliability Performance.- Die Attach Quality Testing by Structure Function Evaluation.- The Mechanical Behavior of Flip Chip Packages Under Thermal Loading.- Li Li Stress Analysis on Processed Silicon Wafer and Packaged Micro-device.- Metallurgy, Processes and Reliability of Lead-Free Solder Inconnects.

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